No more surprises in semiconductor manufacturing

Real-time predictive analytics for manufacturing

Optimize your Smart Factory with machine-learning (ML) predictive models from Lynceus. The only AI-powered predictive platform that runs inline and in real-time with the manufacturing process steps in your fab using the data you already have. The Lynceus Argo platform can be easily integrated with any MES-based process flows.

The Lynceus Argo platform provides immediate alerts to process engineers and fab managers if there is a predicted process excursion, and then provides the contextual information to rapidly drill down into the root cause. The combination of real-time predictions with quick and easy drill downs into your fab data transforms your engineers into manufacturing yield and quality superstars.

Process-agnostic and Production-proven

ML predictive models that can be up and running in weeks, not months or years, and no “big data infrastructure” is required. Only the data that you already have today.

Real-Time Product Visibility

Monitor 100% of units produced and reduce mean time to detection from hours to minutes

Reduced Metrology Cost

Faster cycle-time by only sampling units that do not pass ML predictions

Faster Engineering Response

Rapid and more focused root cause analysis with automated diagnosis

Lynceus is different, because our approach is different

The Lynceus platform (Argo) is architected for Industry 4.0 and Smart Manufacturing

Process-centric ML models

Our ML models are uniquely designed from the ground up with a process-centric approach for maximum performance and accuracy

Robust and Production-proven

Our technology is patented with proprietary training techniques that deliver superior robustness in real-time manufacturing

Cloud-native platform

Lynceus Argo is a cloud-native platform for maximum performance and flexibility, but can also run on-premise if needed

The Lynceus Argo Process Flow

The Lynceus platform can be adapted and deployed across any manufacturing process flow including:

  • Etch
  • Lithography
  • CMP
  • Ion Implantation
  • CVD